Semiconductor & Technology Specialist, Ingenuity

William Keating

Dr. William Keating is a highly experienced senior executive with over 25 years experience in the IT/Semiconductor Industry. The majority of Dr. Keating's career was spent at Intel Corporation where he held senior leadership positions in Europe, the US and Asia from 1992 through 2014. He served as Intel's IT Director for APAC, China & Japan from 2005 through 2014 when he was based in Hong Kong and was responsible for the IT systems (Infrastructure, Networks, Data Centres, ERP, Sales & Marketing systems, Business Intelligence etc. ) for all of Intel's offices & factories through the region. From 1998 through 2005, he was the founder & director of an internal IT Consulting Organisation (IT Flex Services), a 500-person team which remains a core part of the Intel IT Organisation to this day. Dr. Keating's first 6 years at Intel were spent in charge of the Factory Automation Systems (Robotics, Databases, Networks, Servers, Clients etc.) supporting Intel's then state-of-the-art 200mm factory network. Since leaving Intel in 2014, Dr Keating established his own Technology Research & Consulting Company (www.ingenuity.hk) where he focuses on the products, roadmaps & technologies of companies such as Intel, AMD, Samsung, Apple, Micron- as well as the key equipment suppliers to those companies e.g. ASML, AMAT, Canon, Nikon etc. Dr. Keating specializes in niche topics of high significance within the semiconductor industry. These include the future of Moore's Law and in particular the significance of Lithography in maintaining Moore's Law (EUV, SDA, NanoImprint), the role & growth of the GPU in specialised applications such as Deep Learning (Neural Networks) for Voice, Image & Pattern recognition at companies such as Facebook, Google & Baidu. He also holds regular discussions on the future of memory, in particular the rise of 3D NAND and the emergence of new memory technologies such as 3D Xpoint.

Semiconductor & Technology Specialist

Intel. Reality Bites As Margins Shrink On The Back Of Mix, 10nm Yields & Growing Competition

TSMC Vs. Samsung.  Where's the Net Add Upside?

Hynix Earnings Recap - Oh, Oh - Is Everyone Running the Same Direction?

Intel. Deja Vu All Over Again With 7nm Delayed One Year. Long TSMC.

Intel. How Should We Interpret Jim Keller's Untimely Departure?

AI Hardware. Executive Departures & Product Cancellations Signal Troubled Times For Intel's Roadmap.

Battle Lines Drawn As BABA Builds Out First/Last-Mile Capacity; But Who Will Fund 75+ Bn CNY CapEx?

Ingenuity

Our focus is exclusively on in-depth research & consulting in the broader semiconductor industry. We focus on the key players, namely Intel, Micron, Qualcomm, Apple, Samsung, NVIDIA, AMD, TSMC & Global Foundries - as well as some of the lesser known, but nonetheless critical, companies such as ASML (for EUV), Mellanox, Cavium, Xilinx etc. We specialise in their products, roadmaps, process technologies, competitive advantages & threats etc. We also help our clients understand the implications of new and emerging technologies, e.g. 3D X-Point, 3D NAND, Carbon Nanotubes, Autonomous Driving, Graphene, Silicon Photonics, Wafer-Level Optics, Artificial Intelligence, FPGA, GPU, ASIC etc. 

Semiconductor Analysis & Research

Equity Bottom-Up

<p><a href="https://www.smartkarma.com/entities/intel-corp" target="_blank" data-smartkarma-citation="entities:16764:1" rel="noopener">Intel</a>  held its latest Architecture Day on August 13 last, a virtual event led by the company's newly appointed Chief Architect, Raja Koduri. The event featured an impressive lineup of Intel fellows and architects, each providing details on the progress the company is making on its so-called six pillars of technology innovation namely: process and packaging, architecture, memory, interconnects, security and software.</p><p>Intel's Architecture Day 2020 featured multiple, notable new disclosures and was generally well received by the media. However, the elephant in the room, i.e. the continuing erosion of Intel's process technology leadership, rated not a single mention. Instead, much emphasis was placed on improvements to Intel's 10nm transistor design, dubbed SuperFin, which apparently will deliver the company's biggest ever intra-node performance improvement. Here's what Intel had to say about their new SuperFin transistor among other things. </p>

Intel  held its latest Architecture Day on August 13 last, a virtual event led by the company's newly appointed Chief Architect, Raja Koduri. The event featured an impressive lineup of Intel fellows and architects, each providing details on the progress the company is making on its so-called six pillars of technology innovation namely: process and packaging, architecture, memory, interconnects, security and software.Intel's Architecture Day 2020 featured multiple, notable new disclosures and was generally well received by the media. However, the elephant in the room, i.e. the continuing erosion of Intel's process technology leadership, rated not a single mention. Instead, much emphasis was placed on improvements to Intel's 10nm transistor design, dubbed SuperFin, which apparently will deliver the company's biggest ever intra-node performance improvement. Here's what Intel had to say about their new SuperFin transistor among other things. 

Intel Architecture Day 2020. Forget 7nm, We've Got SuperFins!