Semiconductors, Memory and SSDs Specialist, Objective Analysis

Jim Handy

Semiconductors, Memory and SSDs Specialist

Objective Analysis

Objective Analysis offers third-party independent market research and data for the semiconductor industry and investors in the semiconductor industry.

Semiconductors, Memory and SSDs

Thematic (Sector/Industry)

<ul>
<li>HBM DRAM, used for GPUs in AI, has enjoyed stable pricing while other DRAM prices have collapsed</li>
<li>This has attracted the attention of all DRAM makers, but SK hynix has a first-mover advantage</li>
<li>Although increased competition will reduce HBM prices, it will have little impact on GPU maker margins</li>
</ul>


HBM DRAM, used for GPUs in AI, has enjoyed stable pricing while other DRAM prices have collapsed
This has attracted the attention of all DRAM makers, but SK hynix has a first-mover advantage
Although increased competition will reduce HBM prices, it will have little impact on GPU maker margins


External broker reports(aggregated public sources), CMB International

CMB International

External broker reports(aggregated public sources)

Incorporated in Hong Kong, supported by the mainland and targeting in global market, CMB International Capital Corporation Limited (“CMBI”) is an integrated financial institution providing comprehensive and professional services. As a wholly-owned subsidiary of China Merchants Bank ("CMB"), by leveraging on the Group’s synergy and coordination in domestic and overseas markets, as well as CMB’s strong resources and outstanding social reputation, CMBI and its subsidiaries have been actively implementing diversified business strategies and set up an overall layout of main business segments including Corporate Finance, Asset Management, Wealth Management, Global Markets and Structured Finance, etc. Adhering to the philosophy of “being clients oriented and increasing our own values by the way of creating value for clients”, CMBI endeavors to provide quality and integrated financial services to institutional, corporate and individual customers both domestic and overseas including Hong Kong IPO sponsorship and underwriting, share placement and rights issue for listed companies, financial advisors, bonds issuance services, asset management, direct investment, wealth management, equity sales and trading, etc.

<ul><li>NVIDIA reported another strong beat against elevated expectations, along with a strong outlook (guided 4Q revenue of US$20bn, vs consensus US$17.9bn), alleviating concerns on supply constraints and impact on China sales. Key highlights include: 1) FY4Q24E guidance beat on stronger topline/margin with strong AI demand and robust product pipeline into 2024</li><li>2) China’s sales to drop significantly in 4Q23, largely offset by strong growth in other regions, and new regulation-compliant solutions will be available for China (20-25% of DC sales) in the next few months</li><li>3) mgmt. guided continued chip capacity expansion to meet growth, and expected data center revenue to grow through 2025</li></ul>Content is external broker report sourced from online content aggregator through publicly available sources and is displayed below for general informational purposes only. Refer full disclaimer below.

NVIDIA reported another strong beat against elevated expectations, along with a strong outlook (guided 4Q revenue of US$20bn, vs consensus US$17.9bn), alleviating concerns on supply constraints and impact on China sales. Key highlights include: 1) FY4Q24E guidance beat on stronger topline/margin with strong AI demand and robust product pipeline into 20242) China’s sales to drop significantly in 4Q23, largely offset by strong growth in other regions, and new regulation-compliant solutions will be available for China (20-25% of DC sales) in the next few months3) mgmt. guided continued chip capacity expansion to meet growth, and expected data center revenue to grow through 2025Content is external broker report sourced from online content aggregator through publicly available sources and is displayed below for general informational purposes only. Refer full disclaimer below.

China Technology – NVIDIA FY3Q24: Another Stunning Quarter on Robust AI Demand

Asia and Global Semiconductor and Tech Research

Andrew Lu

<ul>
<li>SEMI reports Oct front/back end equipment billings decline of 14% and 18% y/y, respectively, which was improved from 18% and 24% y/y decline in September, implying early signs of recovery.</li>
<li>WSTS/SIA earlier reported September sales of US$44.89bn, up 1.9% m/m and down only 4% y/y (vs. 16% decline in June), suggesting semi sales y/y improvement and pass the cycle trough.</li>
<li>We are positive on SOX INDEX likely to break new high of over 4,000 in six months and expect PC/smartphone/training AI semi and DRAM semi/equipment vendors to outperform in short.</li>
</ul>


SEMI reports Oct front/back end equipment billings decline of 14% and 18% y/y, respectively, which was improved from 18% and 24% y/y decline in September, implying early signs of recovery.
WSTS/SIA earlier reported September sales of US$44.89bn, up 1.9% m/m and down only 4% y/y (vs. 16% decline in June), suggesting semi sales y/y improvement and pass the cycle trough.
We are positive on SOX INDEX likely to break new high of over 4,000 in six months and expect PC/smartphone/training AI semi and DRAM semi/equipment vendors to outperform in short.


What Oct US SEMI Equipment and Sep SIA/WSTS Global Sales Tell Us?

Taiwan Tech Focused Senior Analyst

Patrick Liao

Equity Bottom-Up

Taiwan Semiconductor (TSMC) - ADR / Equity Bottom-Up

<ul>
<li>TSMC's N2 technology is currently undergoing verification for a 256Mb SRAM, and it will be implemented in Hsinchu and Kaohsiung, Taiwan.</li>
<li>The TSMC N3 technology capacity was 65kwpm in 3Q23, and the current version is N3B, which were adopted by Apple for the iPhone 15 this year.</li>
<li>Both N3E and N2 only have 20 layers EUV masks.</li>
</ul>


TSMC's N2 technology is currently undergoing verification for a 256Mb SRAM, and it will be implemented in Hsinchu and Kaohsiung, Taiwan.
The TSMC N3 technology capacity was 65kwpm in 3Q23, and the current version is N3B, which were adopted by Apple for the iPhone 15 this year.
Both N3E and N2 only have 20 layers EUV masks.


TSMC (2330.TT; TSM.US): N2 Technology Is Scheduled in 2025F.

<ul><li>As we finished week 1-4 of 3Q earnings season for major global fabless/IDM semi companies (AMD/Intel/Qualcomm/TI/Infineon/STM/MTK/OnSemi), results/ guidance have been mixed on inventory level and demand recovery.</li><li>Overall, SP/PC/NB (QCOM/MTK/Intel/AMD) started restocking given seasonal demand on new product launches, and server market (Intel/AMD) has shown signs of normalised inventory and mild recovery into 4Q.</li><li>Auto segment (TI/STM/ON) in general began to show cyclical weakness and guided cautious outlook into 4Q. </li></ul>Content is external broker report sourced from online content aggregator through publicly available sources and is displayed below for general informational purposes only. Refer full disclaimer below.

As we finished week 1-4 of 3Q earnings season for major global fabless/IDM semi companies (AMD/Intel/Qualcomm/TI/Infineon/STM/MTK/OnSemi), results/ guidance have been mixed on inventory level and demand recovery.Overall, SP/PC/NB (QCOM/MTK/Intel/AMD) started restocking given seasonal demand on new product launches, and server market (Intel/AMD) has shown signs of normalised inventory and mild recovery into 4Q.Auto segment (TI/STM/ON) in general began to show cyclical weakness and guided cautious outlook into 4Q. Content is external broker report sourced from online content aggregator through publicly available sources and is displayed below for general informational purposes only. Refer full disclaimer below.

China Technology – Global Fabless/IDM 3Q23 Wrap: PC/SP Recovery, Auto/ Industrial Mixed

United States

Advanced Micro Devices, Inc. (AMD) produces semiconductor products and devices. The Company offers products such as microprocessors, embedded microprocessors, chipsets, graphics, video and multimedia products and supplies it to third-party foundries, as well as provides assembling, testing, and packaging services. AMD serves customers worldwide.

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Advanced Micro Devices (AMD US)

HBM's Impact on DRAM Revenues

HBM DRAM prices remained stable while mainstream DRAM prices collapsed, attracting attention from all DRAM makers. SK hynix holds a first-mover...

Jim Handy

China Technology – NVIDIA FY3Q24: Another Stunning Quarter on Robust AI Demand

NVIDIA reported another strong beat against elevated expectations, along with a strong outlook (guided 4Q revenue of US$20bn, vs consensus US$17.9bn)

CMB International

What Oct US SEMI Equipment and Sep SIA/WSTS Global Sales Tell Us?

What Oct US SEMI Equipment and Sep SIA/WSTS Global Sales Tell Us? Telling us early signs of semi equipment and global semi sales recovery and we...

Andrew Lu

TSMC (2330.TT; TSM.US): N2 Technology Is Scheduled in 2025F.

TSMC's N2 technology is currently undergoing verification for a 256Mb SRAM. TSMC N3 technology capacity was 65kwpm in 3Q23. The current version is...

Patrick Liao

China Technology – Global Fabless/IDM 3Q23 Wrap: PC/SP Recovery, Auto/ Industrial Mixed

Overall, SP/PC/NB (QCOM/MTK/Intel/AMD) started restocking given seasonal demand on new product launches, and server market (Intel/AMD) has shown...

CMB International

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52-week Range

Market Cap (USDm)

P/E

Dividend (Yield)

HBM's Impact on DRAM Revenues

​HBM DRAM prices remained stable while mainstream DRAM prices collapsed, attracting attention from all DRAM makers. SK hynix holds a first-mover...

Jim Handy

China Technology – NVIDIA FY3Q24: Another Stunning Quarter on Robust AI Demand

NVIDIA reported another strong beat against elevated expectations, along with a strong outlook (guided 4Q revenue of US$20bn, vs consensus US$17.9bn)

CMB International

What Oct US SEMI Equipment and Sep SIA/WSTS Global Sales Tell Us?

What Oct US SEMI Equipment and Sep SIA/WSTS Global Sales Tell Us? Telling us early signs of semi equipment and global semi sales recovery and we...

Andrew Lu

TSMC (2330.TT; TSM.US): N2 Technology Is Scheduled in 2025F.

TSMC's N2 technology is currently undergoing verification for a 256Mb SRAM. TSMC N3 technology capacity was 65kwpm in 3Q23. The current version is...

Patrick Liao

China Technology – Global Fabless/IDM 3Q23 Wrap: PC/SP Recovery, Auto/ Industrial Mixed

Overall, SP/PC/NB (QCOM/MTK/Intel/AMD) started restocking given seasonal demand on new product launches, and server market (Intel/AMD) has shown...

CMB International

HBM DRAM prices remained stable while mainstream DRAM prices collapsed, attracting attention from all DRAM makers. SK hynix holds a first-mover...