Tracking developments across tech supply chains, Tech Supply Chain Tracker

Tech Supply Chain Tracker

Tracking developments across tech supply chains

Equity Bottom-Up

TongFu Microelectronics   / Equity Bottom-Up

<ul><li>TSMC's new wafer manufacturing technology is changing the advanced packaging industry, causing a forecasted slump in general-purpose memory for Samsung and SK Hynix.</li><li>Micron is leading the way in HBM4 development, aiming for mass production by 2026, while India's semiconductor growth is highlighted by Marvell ahead of VLSI conference.</li><li>China's chip crackdown escalates as global semiconductor landscape evolves, with Tesla Shanghai factory head resigning and Xiaomi denying poaching rumors. Dixon partners with Vivo to boost local production in India.</li></ul>

TSMC's new wafer manufacturing technology is changing the advanced packaging industry, causing a forecasted slump in general-purpose memory for Samsung and SK Hynix.Micron is leading the way in HBM4 development, aiming for mass production by 2026, while India's semiconductor growth is highlighted by Marvell ahead of VLSI conference.China's chip crackdown escalates as global semiconductor landscape evolves, with Tesla Shanghai factory head resigning and Xiaomi denying poaching rumors. Dixon partners with Vivo to boost local production in India.

Tianshui Huatian Technology Co, Ltd. (002185 CH)

Tech Supply Chain Tracker (24-Dec-2024): TSMC transforms packaging market with wafer manufacturing 2.0.