ENTITY

Shenzhen Danbond Technology (002618 CH)

Information Technology • China

Shenzhen Danbond Technology Company Limited develops, produces and sells flexible packaging substrates for FPC and COF products, and produces COF products.

Refresh

Focused

No publications yet

There aren’t any podcasts right now

Back to "All"

Price Gauge
52-week Range	0.00 - 0.00
Market Cap (USDm)	0.00
P/E	0.00
Dividend (Yield)	0.00