ENTITY

Shenzhen Danbond Technology (002618 CH)

Information Technology • China

Shenzhen Danbond Technology Company Limited develops, produces and sells flexible packaging substrates for FPC and COF products, and produces COF products.

Price Gauge
52-week Range	0.00 - 0.00
Market Cap (USDm)	0.00
P/E	0.00
Dividend (Yield)	0.00