bullish

Ushio Inc

Ushio (6925 JP): Tie-Up with Applied Materials Adds to Long-Term Potential

531 Views02 Jan 2024 12:41
Tie up with AMAT in advanced IC package substrate lithography increases gearing to next semiconductor up-cycle. Shares down 10% from December high, an entry point. 3Q results out February 9.
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Scott Foster
Senior Technology Analyst, Japanese Equities
LightStream Research
JapanInformation TechnologyEquity Bottom-UpThematic (Sector/Industry)
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