ENTITY
Kinsus Interconnect Tech

Kinsus Interconnect Tech (3189 TT)

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Analysis
Information TechnologyTaiwan
Kinsus Interconnect Technology Corp. manufactures BGA (Ball Grid Array) boards. The Company's products include PBGA (Plastic BGA), MCM (Multi Chip Module) BGA, Mini BGA, TEBGA (Thermal Enhanced BGA), and flip chip substrate boards.
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04 Sep 2022 23:41

Taiwan Tech Weekly: More Nvidia Issues, Broadcom Surprises, Yulon Soars

Nvidia shares sink in reaction to US banning high-end chip sales to China, Taiwan's Nvida suppliers and the overall sector fall as well. Broadcom...

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17 Aug 2021 13:00Syndicated

Kinsus Interconnect (3189 TT) Upbeat ABF Demand & BT Order Visibility

With capacity expansion and rising IC substrate price, Kinsus’ sales are expected to maintain a double-digit growth in 2021. As such, we forecast...

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16 Feb 2020 04:54

Taiwan - Increased Shorts in Largan, UMC, Yageo; Covering in AUO, Asmedia, Catcher, Hiwin

Total short notional in Taiwan stocks is TWD 250,273 mm (~US$8.34 bn) as of 14 February 2020.Over the week, the largest short positions were put on...

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19 Oct 2017 19:17

TSMC: Strong 2H but Most in Line; Hiking Capex and Pulling in 7nm for Qualcomm?

SummaryDespite much in line 2H17 comparing to consensus estimates, we believe analysts are looking TSMC beyond 2H17 for Qualcomm's 7nm orders back...

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Andrew Lu
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11 Oct 2016 19:46

Taiwan Semi/Tech 3Q Sales Takeaway as an Early Indicator for Global Tech Earnings

Summary Starting October 13, 2016, TSMC will be the first company to report 3Q16 results and provide 4Q16 guidance to kick off semi/tech earnings...

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Andrew Lu
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