Company Presentation • 27 Mar 2025 14:00
Company Presentation • 17 Dec 2024 14:00
Company Presentation • 27 Sep 2024 14:00
Company Presentation • 29 May 2024 14:00
Company Presentation • 27 Mar 2024 10:00
ENTITY
Chipbond Technology (6147 TT)
Chipbond Technology (6147 TT)
18
Analysis
Information Technology • Taiwan
CHIPBOND Technology Corporation provides chip packaging service for the IC (Integrated Circuit) industry. The Company manufactures Gold Bump, TCP (Tape Carrier Packaging), Solder Bump, and COG (Chip on Glass), which are applied to the process of packaging.
morex