Asia and Global Semiconductor and Tech Research

Andrew Lu

Former Head of Asia ex-Japan Semiconductor and TFT-LCD/Touch Research at Barclays and Citi Bank, Former Head of Technology at 國金證券

Augmented Reality as New Driver for Semis?

Equity Bottom-Up

Taiwan Semiconductor (TSMC) / Equity Bottom-Up

<h2>What's New?</h2><p>According to a report from The Register, Microsoft on August 22, 2016 revealed its secretive Holographic Processing Unit (HPU) for HoloLens (a battery life of 2-3 hours and weighs 579g) is a custom-designed TSMC-fabricated 28nm coprocessor. This is consistent with what I have highlighted "The 28nm HPU is essentially a highly customized DSP (likely to be done by utilizing TSMC's design service team and foundry processing)" in my July 25 report <a href="https://www.smartkarma.com/insights/augmented-reality-as-new-driver-for-semis" target="_blank" data-smartkarma-citation="insights:4695">Augmented Reality as New Driver for Semis?</a>…</p>

What's New?According to a report from The Register, Microsoft on August 22, 2016 revealed its secretive Holographic Processing Unit (HPU) for HoloLens (a battery life of 2-3 hours and weighs 579g) is a custom-designed TSMC-fabricated 28nm coprocessor. This is consistent with what I have highlighted "The 28nm HPU is essentially a highly customized DSP (likely to be done by utilizing TSMC's design service team and foundry processing)" in my July 25 report Augmented Reality as New Driver for Semis?…

Bingo, Microsoft Confirmed HPU/HoloLens from TSMC 28nm