Taiwan Tech Focused Senior Analyst

Patrick Liao

Being invited, I joined Sellside, i.e. JPMorgan, Nomura and Macquarie, totally around 9-10 years. Before that, I joined International Data Corp (https://www.idc.com/) to be the Asia Semiconductor analyst for nearly 2 years, and being invited to do personal lectures in TSMC, UMC, Samsung and etc. In my working experiences, I also had the chance to join Taiwanese panel company, AUO (2409.TT) and the buyside, Chinalife (2823.TT), totally for over 1 year.
I obtained MS degree from the Tsing-Hua University. Then I worked in the Taiwan Semiconductor companies for around 11 years. I had several US patents during my stay in the Semiconductor industry.

Being worked in the sellside and buyside, I deeply dived in the Greater China Semiconductor industry and directly covered some companies, like TSMC (2330.TT, TSM.US), UMC (2303.TT, UMC.US), Vanguard (5347.TT), ASE (3711.TT, ASX.US), SPIL (merged with ASE and delisted), KYEC ( 2449.TT), JCET (600584.CH), ASMPT (522.HK), GWC (6488.TT), WinSemi (3105.TT), Mediatek (2454.TT), Silergy (6415.TT), Novatek (3034.TT), Guoxin Micro (002049.CH) etc.

ASMP (522.HK): 1Q22 Results and 2Q22 Forecast- A Warm up in 2022 and It Should Be Another Hike in 3Q

ASMP (522.HK):  Hang Seng Tech Index (HSTECH INDEX) Took Out ASMP with NIO Inc (9866 HK).

Holdcos: Charts Amongst The Carnage. Part 2. Hong Kong, Taiwan and ROA

Holdcos: Charts Amongst The Carnage. Part 1. Japan & Korea

Equity Bottom-Up

ASM Pacific Technology / Equity Bottom-Up

<ul>
<li>The 4Q21 revenue is HK$6.2bn (US$796.3mn), a 43.9% increase YoY. GM 41.3% is a 1,051bps increase YoY. </li>
<li>Some memory market customers, like Samsung and Hynix, are adopting ASMP's mainstream wire bond and advanced packaging tools for high volume manufacturing requirements. </li>
<li>Full year 2021 dividend per share of HK$3.90, a 44.4% YoY increase.</li>
</ul>


The 4Q21 revenue is HK$6.2bn (US$796.3mn), a 43.9% increase YoY. GM 41.3% is a 1,051bps increase YoY. 
Some memory market customers, like Samsung and Hynix, are adopting ASMP's mainstream wire bond and advanced packaging tools for high volume manufacturing requirements. 
Full year 2021 dividend per share of HK$3.90, a 44.4% YoY increase.


ASMP (522.HK): 4Q21 Results/ 1Q22 Outlook- It’s a Record Q1 at the Mid-Point of Guidance.