Kinsus Interconnect Technology Corp. manufactures BGA (Ball Grid Array) boards. The Company's products include PBGA (Plastic BGA), MCM (Multi Chip Module) BGA, Mini BGA, TEBGA (Thermal Enhanced BGA), and flip chip substrate boards.

On Behalf Of Subsidiaries Kinsus Holding (Samoa) 
Limited And Piotek Holdings Ltd. (Cayman) To Announce The
Disposal Of Subsidiaries Shares.

The Board Approved The New Capital Expenditure Budget

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Kinsus Interconnect Tech (3189 TT)

On Behalf Of Subsidiaries Kinsus Holding (Samoa) Limited And Piotek Holdings Ltd. (Cayman) To Announce The Disposal Of Subsidiaries Shares.

The Board Approved The New Capital Expenditure Budget

Obtaining The Governmental Approval Of Cancellation Of Restricted Employee Shares

The Company To Attend The 2024/Q4 Investor Conference Held By Taishin Securities

The Company To Attend The Investor Conference Held By Masterlink Securities

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