Asia and Global Semiconductor and Tech Research

Andrew Lu

Thematic (Sector/Industry)

<p><em>Starting July 14, 2016, TSMC will first report 2Q16 results and provide 3Q16 guidance to kick off semi/tech earnings season. Our report takeaways suggest strengths in foundry, fabless, and display vendors to drive Taiwan semi sales recovery of 17% y/y in June and 8 out 12 vendors reported a beat on 2Q16 sales guidance. Despite the strengths, we saw weaknesses in power amplifier, touch panel, and solar vendors and our semi leading indicator fell to 8% in June 2016 from this year peak of 31% in</em>…</p>

Starting July 14, 2016, TSMC will first report 2Q16 results and provide 3Q16 guidance to kick off semi/tech earnings season. Our report takeaways suggest strengths in foundry, fabless, and display vendors to drive Taiwan semi sales recovery of 17% y/y in June and 8 out 12 vendors reported a beat on 2Q16 sales guidance. Despite the strengths, we saw weaknesses in power amplifier, touch panel, and solar vendors and our semi leading indicator fell to 8% in June 2016 from this year peak of 31% in…

Taiwan

Taiwan Surface Mounting Technology Corp assembles printed circuit boards (PCBs).

Taiwan Surface Mounting Tech Corp. (6278 TT)

Himax Technologies, Inc. designs and manufactures integrated circuits.  The Company produces liquid crystal displays (LCD).

Kinsus Interconnect Technology Corp. manufactures BGA (Ball Grid Array) boards. The Company's products include PBGA (Plastic BGA), MCM (Multi Chip Module) BGA, Mini BGA, TEBGA (Thermal Enhanced BGA), and flip chip substrate boards.

Macronix International Co., Ltd. designs, manufactures, and markets integrated circuits (ICs) as well as memory products.  The Company's products include nonvolatile memory integrated circuits, mask ROM (Read Only Memory), EPROM (Erasable Programmable ROM), and flash memory products.  Macronix also produces logic ICs for audio, clock generators, and graphic application devices.

Silicon Integrated Systems Corp. manufactures and markets chipsets for computers and multimedia products.

Grand Plastic Technology Corp.  specializes in equipment for back end semiconductor manufacturing.  The Company's equipment is used for bumping in the semiconductor packaging and assembly step.

Topco Scientific Co., Ltd. distributes semiconductor and optoelectronic components and equipment. The Company also designs and contracts water-purifying and treatment systems for hi-tech wastes.

MPI Corporation designs, manufactures, and markets probe cards and probe stations for wafer testing.

Gudeng Precision Industrial Co., Ltd. provides integrated solutions for material handling, transfer and storage. The Company's produces mask case and wafer solution products. Gudeng Precision also offers cleaning and repair services.

XinTec Inc. provides advanced integrated circuit packages and integrated circuit packaging and testing services for the semiconductor industry. The Company's product applications include image sensors, optical sensors,. power management IC, power discrete, analog IC and integrated power devices.

MICRONICS JAPAN CO., LTD. designs, manufactures, and markets probe cards, which are used to inspect semiconductors and integrated circuits (ICs).  The Company also makes wafer probers, probe card testers, IC handlers, and inspection devices used for liquid crystal display (LCD) manufacturing.

Shanghai Sinyang Semiconductor Materials Co. Ltd. develops, produces, and provides services for the electronic chemicals used in the semiconductor industry. The company also provides electronic cleaning and electronic plating core technologies. They develops specialized equipment, such as: chemical materials, equipment, and application process etc.

Shanghai Sinyang Smcndctr Mtls (300236 CH)

EO Technics Co., Ltd. is a laser-based equipment supplier. The Company develops laser technology and applications used for marking, drilling, trimming and cutting.

Techwing Inc., manufactures parts for semiconductor testing equipment. The Company's product includes test handlers, Change of Kit (C.O.K) and test interface boards.  The company's main product, test handlers, is core  semiconductor testing equipment.

Sanken Electric Co., Ltd. manufactures and sells discrete semiconductors such as diodes and transistors, and analog integrated circuits.  The Company also manufactures various kinds of adapters and surge/transient protectors.

Photronics, Inc. manufactures photomasks, which are high precision quartz plates that contain microscopic images of electronic circuits.  The Company's products are used to transfer circuit patterns onto semiconductor wafers during the fabrication of integrated circuits.  Photronics operates manufacturing facilities in Asia, Europe, and North America.

Unisem (M) Berhad manufactures semiconductor devices.  The Company provides turnkey solutions to its customers in wafer grinding, packaging and testing of integrated circuits, tape and reel, and dropship services. Unisem also provides packaging and testing wide range of leadframe packages.

Cohu, Inc. designs, manufactures, and sells semiconductor test handling equipment to semiconductor manufacturers throughout the world.  The Company also manufactures closed circuit television, metal detection, and microwave equipment.

PDF Solutions, Inc. provides infrastructure technologies and services to optimize performance and improve yield of manufactured integrated circuits.  The Company provides its services and technologies to integrated device manufacturers such as Toshiba Corporation and Texas Instruments Incorporated.

Mitsui High-tec, Inc. produces integrated circuit leadframes, assembly parts, and related equipment.  The Company also manufactures and sells precision machine tools, such as metal molds for presses and machine tools. Mitsui High-tec also operates a real estate business.

CHIPBOND Technology Corporation provides chip packaging service for the IC (Integrated Circuit) industry.  The Company manufactures Gold Bump, TCP (Tape Carrier Packaging), Solder Bump, and COG (Chip on Glass), which are applied to the process of packaging.

Price Gauge
52-week Range	0.00 - 0.00
Market Cap (USDm)	0.00
P/E	0.00
Dividend (Yield)	0.00

Chipbond Technology (6147 TT)

Points from Taiwan Semi/Tech 2Q Sales

Starting July 14, 2016, TSMC will first report 2Q16 results and provide 3Q16 guidance to kick off semi/tech earnings season. Our report takeaways...

Andrew Lu

Price Gauge

52-week Range

Market Cap (USDm)

P/E

Dividend (Yield)