United States

Ambarella, Inc. manufactures high definition video compression and image processing semiconductors. The Company products are used in digital still cameras, camcorders, and video-enabled mobile phones.

Photronics, Inc. manufactures photomasks, which are high precision quartz plates that contain microscopic images of electronic circuits.  The Company's products are used to transfer circuit patterns onto semiconductor wafers during the fabrication of integrated circuits.  Photronics operates manufacturing facilities in Asia, Europe, and North America.

Parade Technologies Ltd is a fabless semiconductor company that specialzies in high-speed video interfacing and processing products used in personal computer and consumer electronics applications, such as digital TVs, DVDs, monitors and display panels, and set-top boxes.

Veeco Instruments Inc. manufactures enabling solutions for customers in the HB-LED, solar, data storage, semiconductor, scientific research and industrial markets. The Company has technology positions in three businesses: LED & Solar Process Equipment, Data Storage Process Equipment, and Metrology Instruments.

Cohu, Inc. designs, manufactures, and sells semiconductor test handling equipment to semiconductor manufacturers throughout the world.  The Company also manufactures closed circuit television, metal detection, and microwave equipment.

MaxLinear, Inc. provides integrated, radio-frequency analog and mixed-signal semiconductor solutions for broadband communications applications. The Company's products enable the display of broadband video in a wide range of electronic devices, including cable and terrestrial set top boxes, digital televisions, mobile handsets, personal computers, and netbooks.

Ultra Clean Holdings, Inc. develops and supplies critical subsystems for the semiconductor capital equipment industry, focusing on gas delivery systems. These gas delivery systems enable the precise delivery of specialty gases used in a majority of the key steps in the semiconductor manufacturing process.

SolarEdge Technologies Inc. provides solar power optimization and photovoltaic monitoring solutions. The Company offers optimizers, inverters, monitoring equipment, tools, and accessories for power harvesting, conversion, and efficiency. SolarEdge Technologies serves customers worldwide.

PDF Solutions, Inc. provides infrastructure technologies and services to optimize performance and improve yield of manufactured integrated circuits.  The Company provides its services and technologies to integrated device manufacturers such as Toshiba Corporation and Texas Instruments Incorporated.

Alpha & Omega Semiconductor Ltd. designs and manufactures semiconductors. The Company produces analog switches, power integrated circuits, and transient voltage suppressors for notebook computers, battery pack protection, liquid crystal display backlight inverters, cellular phones, and  digital cameras. Alpha & Omega Semiconductor conducts operations internationally.

Kinsus Interconnect Technology Corp. manufactures BGA (Ball Grid Array) boards. The Company's products include PBGA (Plastic BGA), MCM (Multi Chip Module) BGA, Mini BGA, TEBGA (Thermal Enhanced BGA), and flip chip substrate boards.

Macronix International Co., Ltd. designs, manufactures, and markets integrated circuits (ICs) as well as memory products.  The Company's products include nonvolatile memory integrated circuits, mask ROM (Read Only Memory), EPROM (Erasable Programmable ROM), and flash memory products.  Macronix also produces logic ICs for audio, clock generators, and graphic application devices.

MICRONICS JAPAN CO., LTD. designs, manufactures, and markets probe cards, which are used to inspect semiconductors and integrated circuits (ICs).  The Company also makes wafer probers, probe card testers, IC handlers, and inspection devices used for liquid crystal display (LCD) manufacturing.

Radiant Opto-Electronics Corporation develops, manufactures, and markets optoelectronics products. The Company's main products are liquid crystal display (LCD) backlight units, and backlight processed components and sub-assemblies.

CHIPBOND Technology Corporation provides chip packaging service for the IC (Integrated Circuit) industry.  The Company manufactures Gold Bump, TCP (Tape Carrier Packaging), Solder Bump, and COG (Chip on Glass), which are applied to the process of packaging.

EO Technics Co., Ltd. is a laser-based equipment supplier. The Company develops laser technology and applications used for marking, drilling, trimming and cutting.

Topco Scientific Co., Ltd. distributes semiconductor and optoelectronic components and equipment. The Company also designs and contracts water-purifying and treatment systems for hi-tech wastes.

TOWA CORPORATION produces semiconductor manufacturing equipment including mold packaging, IC inspection units, precision molds and dies, and plastic molds. The Company also provides technical consultation.

MPI Corporation designs, manufactures, and markets probe cards and probe stations for wafer testing.

China Wafer Level CSP Company Limited provides Wafer level chip size package and testing services.  The Company's main products include image sensor chip, the ambient light sensor chip, medical and electronic devices, micro-electromechanical system (MEMS), radio frequency identification chip (RFID).

Semtech Corporation designs, manufactures, and markets a wide range of analog and mixed-signal semiconductors, including integrated circuits, discrete circuits, and assembly products. The Company's devices are used in computer, communications, industrial, military-aerospace, and automotive applications.

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